Grenoble-based hardware venture Quobly has finalized a €115 million ($133.5 million USD) Series A financing round to transition its silicon-based quantum computing architecture from technology validation into active industrial execution. The capital expansion was co-led by Bpifrance (investing via the Deep Tech 2030 fund under the France 2030 initiative), post-quantum cybersecurity specialist SEALSQ, and semiconductor manufacturer STMicroelectronics. Additional institutional and strategic backing was provided by the European Innovation Council (EIC Fund), Blast, ALIAD (Air Liquide Venture Capital), and early-stage investor Innovacom. The capital injection follows a cumulative €19 million seed phase and is allocated to advance the fabrication, packaging, and commercial delivery of the company’s spin-qubit processing arrays.
Technical Architecture & 300 mm FD-SOI Fabrication Standards
The hardware approach developed by Quobly isolates it from platforms that rely on superconducting loops or trapped-ion topologies by utilizing existing commercial microelectronics fabrication lines. The processor layout encodes quantum information within electron spins using Fully Depleted Silicon-On-Insulator (FD-SOI) transistor structures processed on 300 mm silicon wafers. This manufacturing pathway utilizes modified commercial transistors as spin-qubit containers, leveraging the precision, material purity, and high fabrication yields native to standard semiconductor cleanrooms.
By fabricating these processors within STMicroelectronics’ commercial production environment in Crolles, France, the design leverages established microelectronics standards to achieve identical qubit reproducibility across dense grid arrays. To ensure system-level security from the physical layer up, Quobly works alongside SEALSQ to integrate quantum-resistant hardware roots of trust and cryptographic trusted platform modules (TPMs) directly into the low-temperature control electronics stack, shielding the quantum memory from physical and protocol-level security threats.
Ecosystem Integration & High-Performance Computing Roadmaps
The commercialization framework outlines a phased systems rollout under Quobly’s Alloy product line, prioritizing integration compatibility with existing high-performance computing (HPC) data centers. The company plans to open public cloud-based access to its first generation computing system, Alloy Pioneer, by the end of 2026. This cloud interface relies on Alloy Forge, a dedicated software development environment that enables users to compile and validate quantum chemistry and optimization applications under active hardware noise constraints. Following the cloud testing phase, Quobly plans to transition to on-premises hardware deliveries in 2027, installing the physical computing racks directly into classical supercomputing centers. The systems are engineered with localized power, cryogenic cooling, and footprint requirements that match standard data-center slots, allowing industrial operators to scale local computational capabilities without rebuilding foundational utility infrastructure.
The official corporate financing announcement can be reviewed via the Quobly news here and access the Air Liquide strategic registry here.
June 3, 2026
