Quantum Computing Report

SEALSQ and GlobalFoundries Form Alliance to Develop Post-Quantum Semiconductor Blocks and Cryogenic CMOS Infrastructure

Post-quantum hardware engineer SEALSQ Corp (Nasdaq: LAES) and foundry group GlobalFoundries (Nasdaq: GFS) have signed a strategic Memorandum of Understanding (MoU) to co-develop secure semiconductor platforms, post-quantum cryptography (PQC) IP, and cryogenic silicon control layers. The development track links GlobalFoundries’ commercial Complementary Metal-Oxide-Semiconductor (CMOS) fabrication processes and bulk manufacturing volume with SEALSQ’s hardware-based certified security cores and PQC-ready root-of-trust modules. The joint initiative focuses on moving quantum computing hardware out of boutique lab setups by manufacturing essential system control units within established, high-volume semiconductor cleanrooms.

                         [ SEALSQ - GlobalFoundries Alliance Matrix ]
  Manufacturing Hub   ──► GlobalFoundries high-volume U.S. and European fabrication facilities.
  Hardware IP Module  ──► Hard macro certified PQC blocks engineered with MIPS architecture.
  Cryogenic Engine    ──► CryoCMOS ASICs for sub-Kelvin quantum processing unit (QPU) control.
  Sovereign Mandate   ──► Secure, traceable supply chain alignment supporting U.S. and European policies.

The corporate partnership targets three primary technological segments:

The engineering roadmaps are supervised by SEALSQ CEO Carlos Moreira and GlobalFoundries VP of Quantum Technology Solutions Nicholas Sergeant. The multi-year framework integrates automated cryptographic accelerators inside high-growth modular chiplet configurations, offering a scalable method to protect automotive platforms, defense communication pipelines, and IoT network infrastructure against quantum-enabled decryption strategies. By utilizing GlobalFoundries’ existing high-volume silicon platforms, the partner companies aim to reduce manufacturing costs and technical error limits for customers scaling hybrid classical-quantum digital infrastructure.

The official strategic partnership announcements, technological integration roadmaps, and international semiconductor manufacturing parameters can be reviewed here.

July 8, 2026

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