SemiQon has demonstrated large-scale characterization of quantum dot qubits using its cryogenically optimized CMOS technology. Building on the November 2024 release of its low-power cryogenic CMOS transistor, the company has applied this component to enable control and readout of hundreds of qubit devices during a single cooldown. The transistor design reduces power consumption by a factor of 100, supporting integration of control electronics within cryogenic environments.
To support scalability, SemiQon is developing integrated circuits that combine silicon qubits and on-chip readout. This approach aims to minimize reliance on room-temperature electronics and extensive cabling, which are key constraints in current quantum processor designs. The company used FDSOI silicon-28 substrates for both qubits and interfacing electronics, enabling collection of large-scale statistical data on qubit behavior and fidelity.
Ongoing work includes validation of the chips by partners and early customers, with next steps focused on cryo-compatible packaging. SemiQon’s development strategy emphasizes compatibility with long-term scaling goals, including systems with high-density qubit integration and reduced external infrastructure requirements.
The full announcement is available here.
June 2, 2025
