The U.S. Department of Commerce has signed nine non-binding letters of intent (LOIs) to allocate $2.013 billion in federal incentives under the CHIPS and Science Act. Administered by the CHIPS Research and Development Office, the capital injection establishes a national portfolio targeting advanced manufacturing, sovereign microelectronics innovation, and hardware optimization. The overarching strategic mandate seeks to build domestic semiconductor supply-chain resilience and secure national security infrastructure across five quantum computing modalities: neutral-atom, silicon-spin, superconducting, photonic, and trapped-ion. As a protective condition for the distribution of these federal funds, the U.S. Department of Commerce will obtain passive, minority non-controlling equity stakes in each recipient entity consistent with the amount of funding. The investments will also likely include provisions to provide the government with a discount over the market price as well as specified milestones that must be met before different tranches of the funding is released.
Technical Architecture & Specifications / Operational Implementation
The funding distribution divides capital between two core manufacturing foundries and seven specialized hardware vendors. Within the foundry track, GlobalFoundries is allocated $375 million to build a multi-modality, secure quantum foundry covering superconducting, trapped-ion, photonic, topological, and silicon-spin architectures. Concurrently, IBM will receive $1 billion to establish Anderon, a standalone pure-play subsidiary operating a 300-millimeter quantum wafer foundry in Albany, New York, to fabricate superconducting wiring, bumps, and through-silicon vias (TSVs) and also support other qubit modalities later on.
To start, Anderon will not require a new building. It will be a tenant at the Albany NanoTech Complex and have access to a shared clean room space and utilize the IBM superconducting qubit fabrication process that IBM has developed over the years. So, Anderson will be ready to go as soon as the final legal documents are signed. An expansion of the facilities may be required in the future when Anderon decides to support additional modalities.
By leveraging the 300mm fab and IBM Quantum process, Anderon will be theoretically ready on Day 1 to produce wafers, Day 1 being once the definitive documents are signed.
The remaining capital is distributed to resolve discrete, multi-modality engineering bottlenecks across seven hardware developers:
- Atom Computing ($100 million): Overcoming scaling and integration friction to manipulate, control, and read out arrays containing tens of thousands of neutral-atom qubits.
- Diraq (up to $38 million): Scaling quantum logic units and compact CMOS silicon-spin qubit arrays leveraging standard, sub-dollar manufacturing nodes.
- D-Wave Quantum Inc. ($100 million): Advancing superconducting annealing and gate-model coherence via advanced packaging, interface control, and dielectric material optimization.
- Infleqtion ($100 million): Formulating high-powered optical systems, real-time error correction, and readout subsystems for large-scale neutral-atom arrays.
- PsiQuantum ($100 million): Packaging high-performance electro-optic switches using Barium Titanate (BTO) thin films, low-loss interconnects, and high-temperature single-photon detectors.
- Quantinuum ($100 million): Fabricating low-loss integrated photonics and specialized optical components tuned to trapped-ion critical wavelengths.
- Rigetti (up to $100 million): Miniaturizing readout electronics and scaling next-generation cryostat architectures for superconducting multi-chip modules.
Strategic Positioning & Ecosystem Integration
The coordinated federal funding initiative accelerates multi-year technology roadmaps to transition quantum assemblies from laboratory prototypes to standardized, data-center-compatible platforms. The foundry expansions provide a resilient onshore supply chain, isolating the domestic quantum ecosystem from geopolitical microelectronics vulnerabilities while creating thousands of high-tech manufacturing positions. Under the capital deployment framework, several hardware developers are partnering directly with the newly incentivized foundries—such as Quantinuum and PsiQuantum utilizing GlobalFoundries’ cryogenic CMOS and 3D heterogeneous interconnect manufacturing lines—to de-risk commercial scale-up. The milestone-based award structures mandate that companies achieve validated technical benchmarks before subsequent capital tiers are unlocked, ensuring transparent taxpayer utility as systems scale toward fault-tolerant operation.
You can review the official U.S. Department of Commerce portfolio announcement here. For corporate details regarding the foundry infrastructure buildouts, access the GlobalFoundries press release here and examine the IBM Anderon pure-play foundry launch brief here. Also, Anderon has already set up its website and you can visit it here.
To track individual hardware vendor roadmaps, read the strategic funding updates from Infleqtion here, Quantinuum here, PsiQuantum here, D-Wave Quantum Inc. here, Atom Computing here, Rigetti here, and Diraq here.
May 21, 2026
