Israel-based hardware developer QTREX Quantum Ltd. (Nasdaq: QTEX) has launched a research collaboration with Northeastern University to develop advanced micro-system structures for cryogenic quantum interconnects. Pursuant to the agreement, Northeastern grants QTREX a first option to negotiate a commercial license for all sole or jointly developed intellectual property arising directly from the joint research. Led by Prof. Benyamin Davaji, the effort pairs Northeastern’s Quantum Materials and Sensing Institute with QTREX’s Additively Manufactured Electronics (AME) platform to expand the company’s vertically integrated quantum connectivity pipeline.
The research program focuses on evaluating three-dimensional additively manufactured micro-system structures and interconnect geometries designed to withstand sub-Kelvin operational conditions inside dilution cryostats. Joint engineering teams will characterize conductive, dielectric, and superconducting materials under cryogenic thresholds to ensure low thermal dissipation and signal integrity. By leveraging micron-scale additive deposition, the initiative aims to address a critical hardware bottleneck in scaling quantum processors: replacing traditional bulky, hand-assembled coaxial wiring harnesses with high-density, three-dimensional routing channels printed directly into monolithic structural interfaces.
The collaboration builds on QTREX’s recent operational pivot from legacy medical technology toward advanced quantum packaging and defense electronics. Following its recent fabrication of a single-build AME cryogenic chip carrier and an Israel Innovation Authority grant for custom RF dielectric substrates, this university partnership establishes a structured pathway to translate academic micro-system research into commercialized quantum hardware.
Review the official corporate press release on GlobeNewswire here, and explore our previous coverage of the QTREX Cryogenic AME Chip Carrier here and IIA Cryogenic Material Grant here.
July 27, 2026
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