Swiss deep-tech innovator CCRAFT has successfully finalized an oversubscribed $7.8 million USD (CHF 6.3 million) Series A funding round led by QBIT Capital, with active capital injections from Zürcher Kantonalbank, Apprecia Capital, Spacewalk, and Blue Wonder Ventures. When combined with an additional $3.5 million USD in previously secured public funding and cantonal grants, the company’s total fresh capital reserves reach $11.3 million USD. Spun out of CSEM (the Swiss Center for Electronics and Microtechnology) in April 2025, the Neuchâtel-based manufacturer operates the world’s first independent pure-play foundry specialized in Thin-Film Lithium Niobate (TFLN) photonic chips, positioning itself to supply critical high-speed optical hardware to customers across four continents.

The capital influx will directly accelerate CCRAFT’s industrial-scale manufacturing capabilities to meet the compute and bandwidth demands of artificial intelligence infrastructure, high-speed telecommunications, and quantum technologies. Currently, the global market for photonic integrated circuits sits between $15 billion and $20 billion, with the high-performance TFLN sub-segment expected to capture several billion dollars by the end of the decade. To absorb this expanding market share, CCRAFT’s automated fabrication facility in Neuchâtel is executing a modular scaling roadmap to expand its production platform from pilot volumes up to a capacity of 2,000 wafers per month by 2030.

                        [ CCRAFT Capital & Sourcing Layout ]
  Total Funding Pool  ──► $11.3 Million USD ($7.8M private Series A + $3.5M public backing)
  Technology Origin   ──► Spun out from CSEM following 6 years of deep microfabrication R&D
  Target Production   ──► 2,000 TFLN wafers per month by 2030 at the Neuchâtel facility

The underlying hardware architecture capitalizes on more than six years of intensive microfabrication research transferred directly from CSEM, which remains a long-term innovation partner. Compared to traditional silicon-based alternatives, TFLN-based photonic integrated circuits manipulate and transmit data using light waves rather than electrical currents. This material switch yields exceptionally high modulation bandwidths and low drive voltages, allowing hyper-scale AI data centers to transport massive volumes of processor data over optical networks at superior velocities while drastically cutting the energy required per transmitted bit.

To offer an end-to-end commercial deployment pipeline, CCRAFT has entered into a trilateral strategic partnership via a Memorandum of Understanding (MoU) with Spanish IP pioneer Alcyon Photonics and Indian semiconductor packaging specialist izmo Microsystems. This international alliance bridges the gap between design and high-volume manufacturing by aligning Alcyon’s photonic IP libraries directly with CCRAFT’s ISO-certified 150-mm TFLN fabrication lines. The value chain is completed by izmo Microsystems, which provides advanced heterogeneous integration, co-packaged optics assembly, and system-level testing to transform raw photonic chips into production-ready subsystems.

                          [ Tri-Party Value Chain Bridge ]
  Alcyon Photonics (Spain) ──► Photonic IP libraries & system-level schematic designs
  CCRAFT SA (Switzerland)  ──► Wafer-scale fabrication at 150-mm TFLN pure-play foundry
  izmo Microsystems (India) ──► Heterogeneous integration & co-packaged optics assembly

This strategic manufacturing footprint introduces a geopolitical advantage for Europe, carving out a specialized technological lead in a semiconductor market where traditional silicon manufacturing is heavily consolidated overseas. Led by Co-Founder and CEO Hamed Sattari, CCRAFT is transforming Switzerland from a localized academic research hub into a sovereign, high-precision industrial foundry network. By combining CSEM’s legacy technology platform with verified international supply chains, the enterprise provides defense, telecom, and enterprise server operators with an agile, trusted manufacturing anchor that guarantees intellectual property protection and industrial sovereignty.

The official Series A transaction disclosures, TFLN foundry scaling targets, and executive milestones can be audited here, and the cross-border trilateral partnership data detailing the design-to-packaging workflow can be accessed here.

July 2, 2026

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