QuantumDiamonds GmbH has introduced the QD m.0, the first commercial quantum device designed specifically for semiconductor chip failure analysis. Unveiled in Munich on September 26, 2024, the QD m.0 leverages diamond-based quantum microscopy to provide unprecedented precision in detecting and localizing faults in integrated circuits. This capability is crucial for addressing the challenges posed by modern semiconductor fabrication, particularly in heterogeneous integration and 2.5D/3D packaging.

The QD m.0 addresses critical industry issues by extracting electrical current information across multiple layers of advanced semiconductor chips. Its innovative technology enhances fault detection, improving production yields for complex designs involving die-stacking, through-silicon vias, hybrid bonding, and advanced packaging.

The launch event featured keynotes from CEO Kevin Berghoff and CTO Fleming Bruckmaier, as well as a panel discussion on Europe’s role in the semiconductor industry. QuantumDiamonds, founded in 2022 as a spin-off from the Technical University of Munich, has quickly established partnerships with major players such as Fraunhofer and imec.

The initial batch of QD m.0 units is set to ship by Q4 2024, with the first run already fully allocated. For more information, visit QuantumDiamonds GmbH’s press release here.

October 2, 2024